What Is the Direction of SMT Equipment Upgrade?
The manufacturing industry is in urgent need of transformation and upgrade due to the miniaturization and integration of ICs and CPUs. The design of electronic products is always evolving, and intelligence and automaton have become the main direction for enterprise development.
Surface Mount Technology
Surface Mount Technology (SMT) has seen rapid growth in the last decade. It is now widely used across many industries. SMT's technical advantages allowed it to replace through-hole technologies in many areas.
The process is roughly divided into four parts: printing, SMT, weldment, and testing. SMT technology, with its advantages and characteristics, has revolutionized electronic assembly technology.
High Precision Automatic Printing for SMT Production
The printing process is the first step in surface mount technology. This has a major impact on the quality of the SMT products. The high precision of motion control of the printing presses is one of them.
SMT products strive to achieve high production and "zero defect" goals. Printing machines need to be able to maintain high-speed, stable printing for long periods of time. The motion control system must be able to operate at high speeds, with stability and reliability, for a long time. Innovative technologies from printing component manufacturers are also required.
High-Performance, High-Efficiency, and High-Integration SMT Placement Machines
This placement machine has been designed to ensure high-speed and high-precision automated placement of components. Its impact on accuracy and efficiency is significant. Patch production lines are one of the most demanding in terms of equipment. Their key technologies and their stability are crucial to the overall investment of the production line.
The development trends of placement machines can be summarized by the "four Highs": high integration, flexibility intelligence, greenness and diversification. The demand for complex mounting forms, high density and high functionality is increasing as electronic devices become smaller. The requirements for SMD mounting and hybrid semiconductor mounting have become increasingly strict.
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